Mini Circuits

Power Splitter/CombinerFeatures• low insertion loss, 0.5 dB typ.• excellent isolation, 24 dB typ.• excellent VSWR, 1.22:1 typ.• low amplitude unbalance 0.1 dB typ.• J-leads for excellent solderability and strain reliefApplications• cellular• UHF receivers/transmitters

FBG484/FBV484

FBG484/FBV484 package for Zynq 7000 SoC

DPAK, 1.70 mm pitch; 5 pin, 8.89 mm L X 10.22 mm W X 4.57 mm H body

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NXP

Voltage Level Translator Bidirectional 1 Circuit 1 Channel 500Mbps 6-XSON, SOT1202 (1x1)

TXC 9HT11 2-pin crystal

Farnell

UQFN10 package, 1.4x1.8mm, 0.4mm pitchChip: NLAS7222

Farnell

UQFN10 package, 1.4x1.8mm, 0.4mm pitchBlack pin-1 markChip: NLAS7222

UQFN10 package, 1.4x1.8mm, 0.4mm pitchWhite pin-1 markChip: NLAS7222B

ic

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